Below is a list of all engineering & technology titles recently released or due shortly.
Displaying items 1 to 10 of 30
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John H. Lau, Hong Meng Ho :- Advanced Copper-Gold Wire-Stud Interconnection Technologies |
$223.00
$200.70
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[ McGraw-Hill Education - Europe / Hardback - due 1/Jun/2012 ]
Develop semiconductor chips for low-cost, high-performance electronic products using copper wire, copper stud, and gold stud bonding Advanced Copper-Gold Wire-Stud Interconnection Technologies covers the latest advances in using low-cost copper... |
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Zhenghao Gan, Waisum Wong, Juin J. Liou :- Semiconductor Process Reliability in Practice |
$235.00
$211.50
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[ McGraw-Hill Education - Europe / Hardback - due 1/Jun/2012 ]
A comprehensive reference on process reliability for semiconductor process and design engineers Featuring detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing, Semiconductor Process Reliability in... |
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Robert T. Ratay :- Temporary Structures in Construction |
$198.00
$178.20
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[ McGraw-Hill Education - Europe / Hardback - due 1/Jun/2012 ]
This in-depth, up-to-date reference for the engineering/construction community describes temporary structures used in design and construction--from scaffolding to retaining walls. Temporary Structures in Construction, Third Edition offers practical... |
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Louis Theodore :- Chemical Reactor Analysis and Applications for the Practicing Engineer |
$175.00
$157.50
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[ John Wiley and Sons Ltd / Hardback - due 1/Jun/2012 ]
This books format follows an applications-oriented text and serves as a training tool for individuals in education and industry involved directly, or indirectly, with chemical reactors. It addresses both technical and calculational problems in this... |
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Hans Berger :- Automating with SIMATIC S7-300 Inside TIA Portal: Configuring, Programming and Testing with STEP 7 Professional V11 |
$135.00
$121.50
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[ Publicis MCD Verlag,Germany / Hardback - due 1/Jun/2012 ]
SIMATIC is the globally established automation system for implementing industrial controllers for machines, production plants and processes. SIMATIC S7-300 has been specially designed for innovative system solutions in the manufacturing industry, and... |
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Dr. Harri Holma, Dr. Antti Toskala :- LTE Advanced |
$150.00
$135.00
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[ John Wiley & Sons Inc / Hardback - due 1/Jun/2012 ]
Examining the main technical enhancements brought by LTE-Advanced (LTE-A), this book thoroughly covers 3GPP R10 and R11 specifications. Using illustrations, graphs and real-life scenarios, the authors systematically lead readers through this... |
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Nick Dossis :- Brilliant LED Projects: 20 Electronic Designs for Artists, Hobbyists, and Experimenters |
$40.00
$36.00
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[ McGraw-Hill Education - Europe / Paperback - due 1/Jun/2012 ]
A unique DIY guide to creating visually exciting LED displays using a variety of electronic circuits Brilliant LED Projects reveals how to build inventive, affordable, and impressive LED projects using a selection of components that includes... |
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David Doman :- Engineering the CMOS Library: Enhancing Digital Design Kits for Competitive Silicon |
$155.00
$139.50
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[ John Wiley & Sons Inc / Hardback - due 1/Jun/2012 ]
This book is about gaining a competitive edge in the Integrated Circuit IC marketplace. It suggests that there is an unrecognized value hidden in the safety margins of descriptive views in any piece of intellectual property (IP). This hidden value is... |
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Greg Winkler :- International Green Construction Code (IGCC) Handbook (GreenSource) |
$98.00
$88.20
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[ McGraw-Hill Education - Europe / Hardback - due 1/Jun/2012 ]
This GreenSource guide is essential to understanding and using the ICC's revolutionary new green construction code. International Green Construction Code (IGCC) Handbook provides design professionals, contractors, code officials, and planning/zoning... |
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John H. Lau :- Through-Silicon Vias (TSVs) for 3D Integration |
$223.00
$200.70
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[ McGraw-Hill Education - Europe / Hardback - due 1/Jun/2012 ]
The latest cost- and space-saving methods of 3D integrated circuits Through-Silicon Vias (TSVs) for 3D Integration covers cutting-edge developments in 3D ICs--essential for the development of low-cost, high-performance electronic and optoelectronic... |
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